Deep level transient spectroscopy characterization of defects in p-Si
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DOI:
https://doi.org/10.15625/0868-3166/23736Keywords:
deep level transient spectroscopy, p-silicon, boron-related defects, defect densityAbstract
This study investigates defect states in p-silicon wafer using Deep Level Transient Spectroscopy method. Two-hole traps with activation energy of 0.32 and 0.58 eV were observed at temperatures of 212 and 252 K, respectively. These hole traps could be boron-related defects introduced during doping process. By using capacitance-voltage measurement, the doping concentration was estimated to be approximately 7$\times$10\textsuperscript{15} cm\textsuperscript{-3}, and the maximum defect density of about 4$\times$10\textsuperscript{14} cm\textsuperscript{-3}. The obtained results showed that the high defect states could be formed naturally during deposition progress. Understanding how defects interact within p-Si is essential for defect engineering in the future.
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Funding data
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National Foundation for Science and Technology Development
Grant numbers 103.02-2023.113



